Development of high precise and efficient slicing technology by using unidirectional multi-wire-saw.
نویسندگان
چکیده
منابع مشابه
Wafer Slicing and Wire Saw Manufacturing Technology
Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...
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INSTRUCTIONS The diameter of silicon wafer becomes larger in order to increase the number of chips per one wafer. For such a larger diameter silicon ingot is mainly sliced by using multi-wire method, in which a long thin wire is used with slurry. In this method, several hundreds of wafers could be sliced at the same time. However there are still problems remained, such as large cracks, slurry t...
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this research aims at answering the questions about translation problems and strategies applied by translators when translating cultural concepts. in order to address this issue, qualitative and quantitative study were conducted on two groups of subjects at imam reza international university of mashhad. these two groups were assigned as beginner and advanced translation students (10 students). ...
Experimental Study on Slicing of Sapphire with Fixed Abrasive Diamond Wire Saw
Experimental study on slicing of sapphire with fixed abrasive diamond wire saw was conducted in this paper. The process parameters were optimized through orthogonal experiment of three factors and four levels. The effects of wire speed, feed speed and tension pressure on the surface roughness were analyzed. Surface roughness in cutting direction and feed direction were both detected. The result...
متن کاملUnidirectional photonic wire laser
Photonic wire lasers are a new genre of lasers that have a transverse dimension much smaller than the wavelength. Unidirectional emission is highly desirable as most of the laser power will be in the desired direction. Owing to their small lateral dimension relative to the wavelength, however, the mode mostly propagates outside the solid core. Consequently, conventional approaches to attach a h...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 1990
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.56.1052